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Horizontal Diffusion Furnace

LPCVD Furnace

PECVD Furnace

Equipment for Solar Cell Production

Ultra High Purity Gas Delivery Systems

External Burn System

Chemical Control Panel and Precursor Temperature Controller

Control System SVconCS

 

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Equipment For Solar Cell Production

 

SVCS brings many year experience with quality inherent in semiconductor industry to solar cell production. SV SOL family of equipment includes horizontal batch diffusion furnace for phosphorus or boron doping/diffusion, PECVD or LPCVD horizontal batch furnace for antireflective coating and passivation, ultra high purity gas and liquid delivery systems for both full production and R&D/pilot environments.

EQUIPMENT

  • Horizontal Batch Diffusion Furnace for Phosphorus/Boron Doping/Diffusion (POCL3, BBr3, etc.)
  • Horizontal Batch PECVD Furnace for SixNy Antireflective coating and passivation
  • Automatic/Manual Source Gas Cabinets (GC) for High Purity Gases (SiH4, NH3, O2, etc.)
  • Automatic/Manual Valve Manifold Boxes (VMB) for independent Gas/Liquid Delivery Lines to multiple furnaces and/or other equipment
  • Automatic Temperature Controller for furnace bubbler containers (POCL3/BBr3, etc.)
  • Bulk Liquid Media Delivery for automatic furnace bubbler containers refill
  • Horizontal Batch Diffusion Furnace for Wet/Dry Oxides (passivation, emitters masking and other on demand production cycle steps)

FURNACE SYSTEMS


Wafer size: (pseudo)square standard 125 mm, 156 mm and 210 mm (or any customer specific size)

  Diffusion  PECVD Wet Oxide Dry Oxide
Wafer load / tube (pcs) 400 200+ 200+ 200+
Average cycle time (min) 60 40 process dependent process dependent
Uniformity (minimum guaranteed)        
On wafer (%) 3* 5 process dependent process dependent
Wafer/Wafer (%) 4* 5 process dependent process dependent
Run/Run (%) 3* 4 3 3
Sheet resistance (Ω/) 40-160 not applicable not applicable not applicable
Layer thickness (nm) not applicable 70-80 10…100 10…100
Growth rate, (nm/min) not applicable 4 1…2 0,05…0,1

 

   Minimum guaranteed uniformity for 47Ω/? sheet resistance


Options:
Wafer Handling Automation (Wafer Transfer System, Boat Elevator, Stocker, etc.)


Gas cabinets and Valve Manifold Boxes

Process gases SiH4, NH3, B2H6, PH3, SiH2Cl2, H2, Ar, O2, N2O, N2, etc.

Delivery rate
from units to thousands of slm, continuous, uninterrupted gas supply
by automatic alternating changeover to replenished source vessel


Temperature controller

Heating/Cooling performance +50/-20 °C relative to ambient temperature
Temperature control stability 0.1 °C
Time to stabilize maximum 2 hours


More detailed specifications available in specific data sheets and through representative and factory contacts.